JPH073647Y2 - 半導体圧力センサ - Google Patents
半導体圧力センサInfo
- Publication number
- JPH073647Y2 JPH073647Y2 JP16553788U JP16553788U JPH073647Y2 JP H073647 Y2 JPH073647 Y2 JP H073647Y2 JP 16553788 U JP16553788 U JP 16553788U JP 16553788 U JP16553788 U JP 16553788U JP H073647 Y2 JPH073647 Y2 JP H073647Y2
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- semiconductor substrate
- pressure sensor
- pressure
- dimension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 33
- 239000000758 substrate Substances 0.000 claims description 25
- 239000013078 crystal Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16553788U JPH073647Y2 (ja) | 1988-12-21 | 1988-12-21 | 半導体圧力センサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16553788U JPH073647Y2 (ja) | 1988-12-21 | 1988-12-21 | 半導体圧力センサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0286152U JPH0286152U (en]) | 1990-07-09 |
| JPH073647Y2 true JPH073647Y2 (ja) | 1995-01-30 |
Family
ID=31452113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16553788U Expired - Lifetime JPH073647Y2 (ja) | 1988-12-21 | 1988-12-21 | 半導体圧力センサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH073647Y2 (en]) |
-
1988
- 1988-12-21 JP JP16553788U patent/JPH073647Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0286152U (en]) | 1990-07-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |